Fishie
02-03-2003, 03:49 AM
BW0004 FEB 02,2003 17:00 PACIFIC 20:00 EASTERN
( BW)(SAMSUNG) Samsung Develops Industry's First SiP; Stacking Processor With NAND Flash and SDRAM
Business Editors/High-Tech Writers
GSM World Congress Conference
SEOUL, Korea--(BUSINESS WIRE)--Feb. 3, 2003--Samsung Electronics, the world's second largest semiconductor manufacturer, today announced the industry's first System-in-Package (SiP) with an ARM(R)-based processor, NAND flash and SDRAM for next-generation mobile phone and handheld applications. The new SiP solution integrates advanced logic and memory technology into a single package, reducing component count and shrinking form factors for handheld devices. This gives PDA and smartphone designers the flexibility to create a new range of cell phone designs and form factors that also support advanced features such as multimedia.
"The integration of data, voice and video in smartphones and PDA's requires higher performance, longer battery life, and increasing memory density in a sleek package," said Dr. Hyung Lae Roh, executive vice president, SOC R&D Center, Samsung Electronics. "Our SiP solution offers the world's first combination of an application processor with NAND flash, which will be the leading non-volatile storage solution for next-generation handhelds."
The SiP's small form factor, 17x17mm in size and 1.4mm high, integrates Samsung's S3C2410 ARM-based application processor, 256Mb of NAND flash memory and 256Mb of SDRAM memory. The S3C2410 is the world's first System-on-Chip (SOC) to have a NAND flash boot loader.
The S3C2410 features an ARM920T CPU core operating at 203 MHz. The chip supports major operating systems including Microsoft Windows CE, Palm OS, Symbian, and Linux.
The S3C2410 SOC offers a set of tailored peripherals for smartphones and other handheld devices that allows integrated support of features that consumers will find attractive and convenient. For example, the S3C2410 application processor includes USB host and device support to allow connectivity to a variety of other devices including PCs, printers, removable storage, and other handhelds. The processor also has SDIO support, which allows handhelds to be accessorized with upcoming SDIO protocol devices such as digital cameras, keyboards, etc.
Samsung's new SiP will be displayed in Stand D57 Hall 2, GSM World Congress Conference, held in Cannes, France, on Feb. 18th - 21st.
Note to editors: ARM is a registered trademark of ARM Limited. Palm, Symbian, Microsoft, Windows and Linux are trademarks of their respective owners.
About Samsung Electronics
Samsung Electronics Co., Ltd. is a global leader in semiconductor, telecommunication, and digital convergence technology. Samsung Electronics employs approximately 64,000 people in 89 offices in 47 countries. Samsung Electronics is the world's leading producer of advanced semiconductors, TFT-LCDs, CDMA mobile phones, monitors and VCRs. Samsung Electronics consists of four main business units: Device Solution Network, Digital Media Network, Telecommunication Network and Digital Appliance Network Businesses.
The Device Solution Network specializes in semiconductor and TFT LCD display products for industrial, mobile and advanced computing applications, offering a full line of key solutions of DRAMs, SRAMs, Display Driver ICs, Smart Card ICs, TFT LCD panels and Flash memories. The Device Solution Network operates 11 overseas sales subsidiaries and mass production facilities to maximize on hand customer support. For more information, visit our website at http://www.samsungsemi.com
Samsung Semiconductor Inc., a wholly owned U.S. subsidiary of Samsung Electronics Co., Ltd., is located in San Jose, Calif. More information can be found at http//www.usa.samsungsemi.com/.
Samsung Semiconductor Europe, a wholly owned subsidiary of Samsung Electronics Co., Ltd., is headquartered in Frankfurt, Germany and London, UK with sales offices all over Europe. More information can be found at http://www.samsungsemi.de
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( BW)(SAMSUNG) Samsung Develops Industry's First SiP; Stacking Processor With NAND Flash and SDRAM
Business Editors/High-Tech Writers
GSM World Congress Conference
SEOUL, Korea--(BUSINESS WIRE)--Feb. 3, 2003--Samsung Electronics, the world's second largest semiconductor manufacturer, today announced the industry's first System-in-Package (SiP) with an ARM(R)-based processor, NAND flash and SDRAM for next-generation mobile phone and handheld applications. The new SiP solution integrates advanced logic and memory technology into a single package, reducing component count and shrinking form factors for handheld devices. This gives PDA and smartphone designers the flexibility to create a new range of cell phone designs and form factors that also support advanced features such as multimedia.
"The integration of data, voice and video in smartphones and PDA's requires higher performance, longer battery life, and increasing memory density in a sleek package," said Dr. Hyung Lae Roh, executive vice president, SOC R&D Center, Samsung Electronics. "Our SiP solution offers the world's first combination of an application processor with NAND flash, which will be the leading non-volatile storage solution for next-generation handhelds."
The SiP's small form factor, 17x17mm in size and 1.4mm high, integrates Samsung's S3C2410 ARM-based application processor, 256Mb of NAND flash memory and 256Mb of SDRAM memory. The S3C2410 is the world's first System-on-Chip (SOC) to have a NAND flash boot loader.
The S3C2410 features an ARM920T CPU core operating at 203 MHz. The chip supports major operating systems including Microsoft Windows CE, Palm OS, Symbian, and Linux.
The S3C2410 SOC offers a set of tailored peripherals for smartphones and other handheld devices that allows integrated support of features that consumers will find attractive and convenient. For example, the S3C2410 application processor includes USB host and device support to allow connectivity to a variety of other devices including PCs, printers, removable storage, and other handhelds. The processor also has SDIO support, which allows handhelds to be accessorized with upcoming SDIO protocol devices such as digital cameras, keyboards, etc.
Samsung's new SiP will be displayed in Stand D57 Hall 2, GSM World Congress Conference, held in Cannes, France, on Feb. 18th - 21st.
Note to editors: ARM is a registered trademark of ARM Limited. Palm, Symbian, Microsoft, Windows and Linux are trademarks of their respective owners.
About Samsung Electronics
Samsung Electronics Co., Ltd. is a global leader in semiconductor, telecommunication, and digital convergence technology. Samsung Electronics employs approximately 64,000 people in 89 offices in 47 countries. Samsung Electronics is the world's leading producer of advanced semiconductors, TFT-LCDs, CDMA mobile phones, monitors and VCRs. Samsung Electronics consists of four main business units: Device Solution Network, Digital Media Network, Telecommunication Network and Digital Appliance Network Businesses.
The Device Solution Network specializes in semiconductor and TFT LCD display products for industrial, mobile and advanced computing applications, offering a full line of key solutions of DRAMs, SRAMs, Display Driver ICs, Smart Card ICs, TFT LCD panels and Flash memories. The Device Solution Network operates 11 overseas sales subsidiaries and mass production facilities to maximize on hand customer support. For more information, visit our website at http://www.samsungsemi.com
Samsung Semiconductor Inc., a wholly owned U.S. subsidiary of Samsung Electronics Co., Ltd., is located in San Jose, Calif. More information can be found at http//www.usa.samsungsemi.com/.
Samsung Semiconductor Europe, a wholly owned subsidiary of Samsung Electronics Co., Ltd., is headquartered in Frankfurt, Germany and London, UK with sales offices all over Europe. More information can be found at http://www.samsungsemi.de
--30--jb/sf*