Kris Kumar
03-28-2006, 02:30 AM
<div class='os_post_top_link'><a href='http://www.japancorp.net/Article.Asp?Art_ID=12143' target='_blank'>http://www.japancorp.net/Article.Asp?Art_ID=12143</a><br /><br /></div><i>"NEC Corporation and UNITIKA LTD. today announced the joint development of bioplastic reinforced with kenaf* fiber, which is expected to contribute greatly to environmental measures for mobile phones. NTT DoCoMo, Inc. (NTT DoCoMo) is already using this new material in the entire casing of its new FOMA(TM) "N701iECO" mobile phone, which it launched on the Japanese market on March 10, 2006. Biomass-based bioplastics, such as polylactic acid (PLA)** that is made of corn, have been drawing attention in recent years as new materials to replace conventional petroleum-based plastics, amid increasing interest and concern over environmental problems such as global warming and resource depletion. However, application of regular PLA to electronic devices is difficult as it has insufficient heat resistance and strength. NEC succeeded in improving the heat resistance and strength of PLA by adding kenaf fiber to it, one measure for the prevention of global warming. Then together with UNITIKA it realized the durability of the new material by applying it to the components of a PC."</i><br /><br /> <img src="http://www.smartphonethoughts.com/images/Kris-Mar06-bioplastic.jpg" alt="User submitted image" title="User submitted image"/> <br /><br />Hurray to NEC and UNITIKA for taking the right steps towards reducing the environmental burden. :)